Tokyo Seimitsu Co., Ltd. Tokyo Seimitsu Co., Ltd.

Tokyo Seimitsu Co., Ltd.

7729

Rang in Aktien #3664
Tokyo Seimitsu Co., Ltd., established in Hachioji, Japan, in 1949, specializes... Tokyo Seimitsu Co., Ltd., established in Hachioji, Japan, in 1949, specializes in the production and sale of advanced semiconductor manufacturing equipment (SPE) and precision measurement tools. The company's operations are divided into two main segments: SPE and Metrology Equipment. Within its SPE division, Tokyo Seimitsu provides a comprehensive suite of machinery crucial for wafer processing, including dicing machines, high-precision dicing blades, probing machines, polish grinders, robust high-rigidity grinders, chemical mechanical planarizers (CMPs), wafer edge grinding machines, and specialized systems for demounting and cleaning sliced wafers. The Metrology Equipment segment offers an extensive array of measuring instruments. This includes multipurpose devices like coordinate measuring machines, instruments for analyzing surface texture, contour, roundness, and cylindrical profiles, as well as optical and optical shaft measuring systems, and X-ray CT systems. Furthermore, the company develops automatic measurement solutions such as in-process and post-process gauge products, various sensors, electric and air micrometers, high-precision digital measurement instruments, and laser interferometers. The company adopted its current name, Tokyo Seimitsu Co., Ltd., in April 1962, having previously operated as Tokyo Seimitsu Kogu Co., Ltd.
Aktienkurs
$113.13
Marktkapitalisierung
$4.59B
Veränderung (1 Tag)
-3.88%
Veränderung (1 Jahr)
70.70%
Land
JP
Handel Tokyo Seimitsu Co., Ltd. (7729)

Kategorie

Technology
Dividendenhistorie für Tokyo Seimitsu Co., Ltd. (7729)
Tokyo Seimitsu Co., Ltd. (Aktienkürzel: 7729) zahlte insgesamt 48 Dividenden.
Die Summe aller Dividenden (angepasst an Aktiensplits) beträgt: $2.00K
Dividendenrendite (TTM): 0.0171
Dividendenzahlungen für Tokyo Seimitsu Co., Ltd. (7729) von 2001 bis 2026
Jährliche Dividendenzahlungen
Jahr Dividende (angepasst an Aktiensplits) ändert
2026 (TTM) $111.00 -50.67%
2025 $225.00 3.69%
2024 $217.00 0.93%
2023 $215.00 2.38%
2022 $210.00 43.84%
2021 $146.00 82.50%
2020 $80.00 -14.89%
2019 $94.00 -6.00%
2018 $100.00 26.58%
2017 $79.00 17.91%
2016 $67.00 13.56%
2015 $59.00 68.57%
2014 $35.00 94.44%
2013 $18.00 12.50%
2012 $16.00 23.08%
2011 $13.00 160.00%
2010 $5.00 -90.91%
2008 $55.00 0.00%
2007 $55.00 22.22%
2006 $45.00 28.57%
2005 $35.00 16.67%
2004 $30.00 0.00%
2003 $30.00 0.00%
2002 $30.00 0.00%
2001 $30.00 0.00%
Liste aller Dividendenzahlungen
Jahr Dividende ändert
2026 (TTM) $111.00 -50.67%
2025 $225.00 3.69%
2024 $217.00 0.93%
2023 $215.00 11.40%
2022 $193.00 32.19%
2021 $146.00 82.50%
2020 $80.00 -14.89%
2019 $94.00 -6.00%
2018 $100.00 26.58%
2017 $79.00 17.91%
2016 $67.00 13.56%
2015 $59.00 68.57%
2014 $35.00 94.44%
2013 $18.00 12.50%
2012 $16.00 23.08%
2011 $13.00 160.00%
2010 $5.00 -90.91%
2008 $55.00 0.00%
2007 $55.00 22.22%
2006 $45.00 28.57%
2005 $35.00 16.67%
2004 $30.00 0.00%
2003 $30.00 0.00%
2002 $30.00 0.00%
2001 $30.00 0.00%
Dividendenzahlungen ähnlicher Unternehmen oder Wettbewerber