Hwatsing Technology Co., Ltd.
688120
Rang in Aktien
#1376
Hwatsing Technology Co., Ltd. engages in the research, development, production,... Hwatsing Technology Co., Ltd. engages in the research, development, production, sales, and technical services of semiconductor equipment in China and internationally. The company offers chemical mechanical polishers, implanters, grinders, bevel polishers, dicers, wet process and film metrology equipment, wafer regeneration and reclaim services, and consumables and maintenance services. Its products are mainly used in integrated circuits, advanced packaging, advanced packaging, large silicon wafers, MEMS, micro-LED, and other third-generation semiconductors. The company was founded in 2013 and is headquartered in Tianjin, China.
Aktienkurs
$31.17
Marktkapitalisierung
$15.94B
Veränderung (1 Tag)
-3.19%
Veränderung (1 Jahr)
119.50%
Land
CN
Handel Hwatsing Technology Co., Ltd. (688120)
Kategorie
Technology
Dividendenhistorie für Hwatsing Technology Co., Ltd. (688120)
Hwatsing Technology Co., Ltd. (Aktienkürzel: 688120) zahlte insgesamt 4 Dividenden.
Die Summe aller Dividenden (angepasst an Aktiensplits) beträgt: $1.09
Dividendenrendite (TTM): 0.0019
Die Summe aller Dividenden (angepasst an Aktiensplits) beträgt: $1.09
Dividendenrendite (TTM): 0.0019
Dividendenzahlungen für Hwatsing Technology Co., Ltd. (688120) von 2023 bis 2026
Jährliche Dividendenzahlungen
| Jahr | Dividende (angepasst an Aktiensplits) | ändert |
|---|---|---|
| 2026 (TTM) | $0.4 | 51.69% |
| 2025 | $0.2637 | 0.00% |
| 2024 | $0.2637 | 63.89% |
| 2023 | $0.1609 | 0.00% |
Liste aller Dividendenzahlungen
| Jahr | Dividende | ändert |
|---|---|---|
| 2026 (TTM) | $0.56 | 51.72% |
| 2025 | $0.3691 | 0.00% |
| 2024 | $0.3691 | 63.90% |
| 2023 | $0.2252 | 0.00% |
Dividendenzahlungen ähnlicher Unternehmen oder Wettbewerber
| Unternehmen | Anzahl der Dividendenzahlungen | Land |
|---|---|---|
| 56.00% |
US
|
|
| 46.00% |
TW
|
|
| 64.00% |
US
|
|
| 34.00% |
US
|
|
| 2.00% |
US
|
