Chipbond Technology Corporation Chipbond Technology Corporation

Chipbond Technology Corporation

6147

Rang in Aktien #3491
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Aktienkurs
$6.63
Zuletzt synchronisiert: 2026-10-19
Marktkapitalisierung
$4.94B
Veränderung (1 Tag)
0.24%
Veränderung (1 Jahr)
249.26%
Land
TW
Handel Chipbond Technology Corporation (6147)

Kategorie

Technology
Aktien-Split-Historie für Chipbond Technology Corporation (6147)
Die Aktie Chipbond Technology Corporation (Symbol: 6147) durchlief insgesamt 3 Aktiensplits.
Der letzte Aktiensplit fand am Aug 05, 2008 statt.
Eine 6147-Aktie, die vor dem Aug 08, 2006 gekauft wurde, entspricht heute 1.0891166688 6147-Aktien.
Liste der Aktiensplits
Jahr Aktien-Split Multiplikator Kumulierter Multiplikator
2008-08-05 25569:25000 x1.02276 x1.0891166688
2007-08-07 51:50 x1.02 x1.06488
2006-08-08 261:250 x1.044 x1.044
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