Chipbond Technology Corporation
6147
Rang in Aktien
#3500
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Aktienkurs
$6.61
Zuletzt synchronisiert: 2026-10-16
Marktkapitalisierung
$4.92B
Veränderung (1 Tag)
-2.12%
Veränderung (1 Jahr)
253.64%
Land
TW
Handel Chipbond Technology Corporation (6147)
Kategorie
Technology
Operative Marge für Chipbond Technology Corporation (6147)
Operative Marge zum October 2026 TTM: 13.60%
Laut den neuesten Finanzberichten und dem Aktienkurs von Chipbond Technology Corporation beträgt die aktuelle operative Marge (TTM) 13.60%. Am Ende des Jahres 2023 lag die operative Marge bei 16.58%.
Historie der operativen Marge von Chipbond Technology Corporation von 2006 bis 2026
Operative Marge zum Jahresende
| Jahr | Operative Marge | ändert |
|---|---|---|
| 2026 (TTM) | 13.60% | 8.80% |
| 2024 | 12.50% | -24.61% |
| 2023 | 16.58% | -48.40% |
| 2022 | 32.13% | 16.37% |
| 2021 | 27.61% | 36.82% |
| 2020 | 20.18% | -22.53% |
| 2019 | 26.05% | 25.06% |
| 2018 | 20.83% | 20.40% |
| 2017 | 17.30% | 7.79% |
| 2016 | 16.05% | 6.22% |
| 2015 | 15.11% | -10.96% |
| 2014 | 16.97% | -0.82% |
| 2013 | 17.11% | -20.53% |
| 2012 | 21.53% | 29.00% |
| 2011 | 16.69% | -28.03% |
| 2010 | 23.19% | 192.80% |
| 2009 | 7.92% | 28.57% |
| 2008 | 6.16% | -69.18% |
| 2007 | 19.99% | 30.82% |
| 2006 | 15.28% | 0.00% |
Operative Marge vergleichbarer Unternehmen oder Wettbewerber
| Unternehmen | Operative Marge | Differenz der operativen Marge | Land |
|---|---|---|---|
| 65.21% | -95.21% |
US
|
|
| 56.04% | -95.88% |
TW
|
|
| 48.36% | -96.44% |
US
|
|
| 75.01% | -94.48% |
US
|
|
| 15.71% | -98.84% |
US
|
Was ist die operative Marge eines Unternehmens?
Die operative Marge ist ein wichtiger Indikator zur Bewertung der Rentabilität eines Unternehmens. Höhere operative Margen sind in der Regel besser, da sie zeigen, dass ein Unternehmen seine Produkte oder Dienstleistungen mit deutlichem Gewinn über den Produktionskosten verkauft. Die operative Marge wird berechnet, indem der Gewinn des Unternehmens durch seinen Umsatz geteilt wird.