HPSP Co., Ltd. HPSP Co., Ltd.

HPSP Co., Ltd.

403870

Rang in Aktien #5105
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
Aktienkurs
$34.57
Marktkapitalisierung
$2.81B
Veränderung (1 Tag)
-4.58%
Veränderung (1 Jahr)
35.51%
Land
KR
Handel HPSP Co., Ltd. (403870)

Kategorie

Technology
Dividendenhistorie für HPSP Co., Ltd. (403870)
HPSP Co., Ltd. (Aktienkürzel: 403870) zahlte insgesamt 4 Dividenden.
Die Summe aller Dividenden (angepasst an Aktiensplits) beträgt: $937.50
Dividendenrendite (TTM): 0.012
Dividendenzahlungen für HPSP Co., Ltd. (403870) von 2022 bis 2026
Jährliche Dividendenzahlungen
Jahr Dividende (angepasst an Aktiensplits) ändert
2026 (TTM) $600.00 0.00%
2025 $600.00 300.00%
2024 $150.00 300.00%
2023 $37.50 -75.00%
2022 $150.00 0.00%
Liste aller Dividendenzahlungen
Jahr Dividende ändert
2026 (TTM) $600.00 0.00%
2025 $600.00 300.00%
2024 $150.00 300.00%
2023 $37.50 -93.75%
2022 $600.00 0.00%
Dividendenzahlungen ähnlicher Unternehmen oder Wettbewerber