HPSP Co., Ltd.
403870
Rang in Aktien
#5111
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
Aktienkurs
$35.96
Marktkapitalisierung
$2.93B
Veränderung (1 Tag)
4.00%
Veränderung (1 Jahr)
43.20%
Land
KR
Handel HPSP Co., Ltd. (403870)
Kategorie
Technology
Dividendenrendite-Verlauf für HPSP Co., Ltd. (403870)
Dividendenrendite (TTM) von HPSP Co., Ltd. (Aktienkürzel: 403870) zum 2023-12-31: 0.05%
Durchschnittliche Dividendenrendite der letzten 5 Jahre: 0.95%
Durchschnittliche Dividendenrendite der letzten 5 Jahre: 0.95%
Dividendenrendite-Verlauf für HPSP Co., Ltd. (403870) von 2018 bis 2026
Dividendenrendite am Ende jedes Jahres (TTM)
| Jahr | Dividendenrendite | ändert |
|---|---|---|
| 2026 (TTM) | 1.20% | 242.86% |
| 2024 | 0.35% | 600.00% |
| 2023 | 0.05% | -95.54% |
| 2022 | 1.12% | -52.14% |
| 2021 | 2.34% | 162.92% |
| 2020 | 0.89% | 8,800.00% |
| 2019 | 0.01% | -98.75% |
| 2018 | 0.80% | 0.00% |
Dividendenrenditen (TTM) für ähnliche Unternehmen oder Wettbewerber
| Unternehmen | Dividendenrendite | Land |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
