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Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Rang in Aktien #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Aktienkurs
$0.48016532
Zuletzt synchronisiert: 2026-08-21
Marktkapitalisierung
$87.70M
Veränderung (1 Tag)
1.34%
Veränderung (1 Jahr)
11.79%
Land
TW
Handel Taiwan IC Packaging Corporation (3372)

Kategorie

Technology
Aktien-Split-Historie für Taiwan IC Packaging Corporation (3372)
Die Aktie Taiwan IC Packaging Corporation (Symbol: 3372) durchlief insgesamt 0 Aktiensplits.
Der letzte Aktiensplit fand am Aug 23, 2026 statt.
Eine 3372-Aktie, die vor dem Aug 23, 2026 gekauft wurde, entspricht heute 0 3372-Aktien.
Liste der Aktiensplits
Jahr Aktien-Split Multiplikator Kumulierter Multiplikator
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