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Winstek Semiconductor Co., Ltd. Winstek Semiconductor Co., Ltd.

Winstek Semiconductor Co., Ltd.

3265
Rang in Aktien #10622
Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers... Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers extensive services in Taiwan, specializing in integrated circuit (IC) testing, wafer bumping, and wafer packaging. Their comprehensive test division provides initial wafer sorting, thorough final and post-production testing, dedicated engineering assistance, and access to advanced test platforms. For wafer bumping, the company delivers a diverse range of solutions, including copper pillar bumps, wafer-level chip scale packaging (WLCSP), lead-free options, plating bump/ball drop/RDL, 6S protection, heterogeneous bumps, and backside metallization. Furthermore, Winstek provides crucial backend services such as die processing, wafer thinning, singulation, and flip-chip integration. They also conduct detailed verification and analysis, which includes failure analysis and reliability assessments. Established in 2000, the company was initially known as Stats ChipPac Taiwan Semiconductor Corp. before officially rebranding to Winstek Semiconductor Co., Ltd. in June 2015. Its main operations are based in Hsinchu City, Taiwan, and it operates as an affiliate of SIGWIN Corporation.
Aktienkurs
$5.93
Zuletzt synchronisiert: 2026-08-28
Marktkapitalisierung
$808.10M
Veränderung (1 Tag)
5.67%
Veränderung (1 Jahr)
76.93%
Land
TW
Handel Winstek Semiconductor Co., Ltd. (3265)

Kategorie

Technology
Dividendenhistorie für Winstek Semiconductor Co., Ltd. (3265)
Winstek Semiconductor Co., Ltd. (Aktienkürzel: 3265) zahlte insgesamt 0 Dividenden.
Die Summe aller Dividenden (angepasst an Aktiensplits) beträgt: 0.00
Dividendenrendite (TTM): 0
Dividendenzahlungen für Winstek Semiconductor Co., Ltd. (3265) von 2026 bis 2026
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