Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

3189

Rang in Aktien #1397
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Aktienkurs
$30.21
Marktkapitalisierung
$15.92B
Veränderung (1 Tag)
-3.26%
Veränderung (1 Jahr)
512.31%
Land
TW
Handel Kinsus Interconnect Technology Corp. (3189)

Kategorie

Technology
Anzahl der ausstehenden Aktien von Kinsus Interconnect Technology Corp. (3189)
Anzahl der ausstehenden Aktien zum June 2026: 655.65M
Laut den neuesten Finanzberichten und dem Aktienkurs von Kinsus Interconnect Technology Corp. beträgt die aktuelle Anzahl der ausstehenden Aktien 655.65M. Am Ende von December 2024 hatte das Unternehmen 453.76M ausstehende Aktien. Die Anzahl der ausstehenden Aktien wird normalerweise durch Aktiensplits und Aktienrückkäufe beeinflusst.
Verlauf der ausstehenden Aktien von Kinsus Interconnect Technology Corp. (3189) von 2004 bis 2026
Ausstehende Aktien am Ende jedes Jahres
Jahr Ausstehende Aktien ändert
2026 (TTM) 655.65M 44.02%
2025 455.24M 0.33%
2024 453.76M -4.50%
2023 475.16M 2.64%
2022 462.96M 14.73%
2021 403.53M -10.64%
2020 451.60M 0.81%
2019 447.96M -0.02%
2018 448.06M 0.24%
2017 446.98M -0.95%
2016 451.25M -0.86%
2015 455.16M 0.41%
2014 453.30M 0.11%
2013 452.82M -0.04%
2012 453.01M 1.57%
2011 446.00M 0.00%
2010 446.00M 0.00%
2009 446.00M 0.00%
2008 446.00M 0.00%
2007 446.00M 8.44%
2006 411.30M 19.34%
2005 344.64M 5.72%
2004 325.98M 0.00%
Ausstehende Aktien bei ähnlichen Unternehmen oder Wettbewerbern
Unternehmen Ausstehende Aktien Unterschied Land
24.19B 3,589.48%
US
25.93B 3,854.83%
TW
4.77B 626.91%
US
1.13B 72.35%
US
1.63B 148.76%
US