LB Semicon, Inc.
061970
Rang in Aktien
#19230
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Aktienkurs
$2.28
Marktkapitalisierung
$159.92M
Veränderung (1 Tag)
-5.98%
Veränderung (1 Jahr)
-40.84%
Land
KR
Handel LB Semicon, Inc. (061970)
Kategorie
Technology
Dividendenhistorie für LB Semicon, Inc. (061970)
LB Semicon, Inc. (Aktienkürzel: 061970) zahlte insgesamt 0 Dividenden.
Die Summe aller Dividenden (angepasst an Aktiensplits) beträgt: 0.00
Dividendenrendite (TTM): 0
Die Summe aller Dividenden (angepasst an Aktiensplits) beträgt: 0.00
Dividendenrendite (TTM): 0
Dividendenzahlungen für LB Semicon, Inc. (061970) von 2026 bis 2026
Jährliche Dividendenzahlungen
| Jahr | Dividende (angepasst an Aktiensplits) | ändert |
|---|---|---|
| Nicht genügend Daten für die angegebenen Daten. | ||
Liste aller Dividendenzahlungen
| Jahr | Dividende | ändert |
|---|---|---|
| Nicht genügend Daten für die angegebenen Daten. | ||
Dividendenzahlungen ähnlicher Unternehmen oder Wettbewerber
| Unternehmen | Anzahl der Dividendenzahlungen | Land |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
