HANMI Semiconductor Co., Ltd.
042700
Rang in Aktien
#1638
Headquartered in Incheon, South Korea, and established in 1980, HANMI... Headquartered in Incheon, South Korea, and established in 1980, HANMI Semiconductor Co., Ltd. is a global provider of advanced semiconductor manufacturing equipment, serving markets both domestically and internationally. The company's extensive product line includes specialized vision-based placement systems and a comprehensive suite of bonding solutions, such as flip chip, TSV dual stacking, TC, jumbo panel flip chip, and die flip chip bonders. HANMI also supplies comprehensive EMI shielding apparatus, encompassing vision-guided attach/detach, precise placement, tape mounting, laser cutting, demounting, and dedicated vision inspection, alongside converlay attach systems. Furthermore, their offerings extend to various testing and handling instruments like power ECU automation, test handlers, vision-enabled placement, trimming, forming, singulation, and sophisticated 3D vision inspection tools. The company manufactures diverse molding equipment, encompassing automated, compression, mechanical, and hydraulic presses. They also provide cutting-edge laser processing solutions, including general and wafer laser marking, ablation, and precise laser cutting/deflash machinery. Completing their portfolio are specialized tools such as cam press trim and form, micro cam press, CSP singulation, pick-and-place, die sorters, strip mounters, and additional testing apparatus.
Aktienkurs
$138.99
Marktkapitalisierung
$13.18B
Veränderung (1 Tag)
0.55%
Veränderung (1 Jahr)
33.02%
Land
KR
Handel HANMI Semiconductor Co., Ltd. (042700)
Kategorie
Technology
Dividendenhistorie für HANMI Semiconductor Co., Ltd. (042700)
HANMI Semiconductor Co., Ltd. (Aktienkürzel: 042700) zahlte insgesamt 22 Dividenden.
Die Summe aller Dividenden (angepasst an Aktiensplits) beträgt: $4.51K
Dividendenrendite (TTM): 0.0083
Die Summe aller Dividenden (angepasst an Aktiensplits) beträgt: $4.51K
Dividendenrendite (TTM): 0.0083
Dividendenzahlungen für HANMI Semiconductor Co., Ltd. (042700) von 2005 bis 2026
Jährliche Dividendenzahlungen
| Jahr | Dividende (angepasst an Aktiensplits) | ändert |
|---|---|---|
| 2026 (TTM) | $800.00 | -47.37% |
| 2025 | $1,520.00 | 261.90% |
| 2024 | $420.00 | 110.00% |
| 2022 | $200.00 | -33.33% |
| 2021 | $300.00 | 50.00% |
| 2020 | $200.00 | 300.00% |
| 2019 | $50.00 | -60.00% |
| 2018 | $125.00 | 4.17% |
| 2017 | $120.00 | 20.00% |
| 2016 | $100.00 | 0.00% |
| 2015 | $100.00 | 0.00% |
| 2014 | $100.00 | 0.00% |
| 2013 | $100.00 | 0.00% |
| 2012 | $100.00 | 400.00% |
| 2011 | $20.00 | -80.00% |
| 2010 | $100.00 | 400.00% |
| 2009 | $20.00 | 0.00% |
| 2008 | $20.00 | -33.33% |
| 2007 | $30.00 | -37.00% |
| 2006 | $47.62 | 34.92% |
| 2005 | $35.29 | 0.00% |
Liste aller Dividendenzahlungen
| Jahr | Dividende | ändert |
|---|---|---|
| 2026 (TTM) | $800.00 | -47.37% |
| 2025 | $1,520.00 | 261.90% |
| 2024 | $420.00 | 110.00% |
| 2022 | $200.00 | -66.67% |
| 2021 | $600.00 | 50.00% |
| 2020 | $400.00 | 300.00% |
| 2019 | $100.00 | -60.00% |
| 2018 | $250.00 | 4.17% |
| 2017 | $240.00 | -80.80% |
| 2016 | $1,250.00 | 0.00% |
| 2015 | $1,250.00 | 0.00% |
| 2014 | $1,250.00 | 0.00% |
| 2013 | $1,250.00 | 0.00% |
| 2012 | $1,250.00 | 400.00% |
| 2011 | $250.00 | -80.00% |
| 2010 | $1,250.00 | 400.00% |
| 2009 | $250.00 | 0.00% |
| 2008 | $250.00 | -36.51% |
| 2007 | $393.75 | -37.00% |
| 2006 | $625.00 | -16.67% |
| 2005 | $750.00 | 0.00% |
Dividendenzahlungen ähnlicher Unternehmen oder Wettbewerber
| Unternehmen | Anzahl der Dividendenzahlungen | Land |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
